Peter Bright at Ars, writing about the upcoming 8th-generation H-series chips:
The chip package will contain multiple pieces of silicon: an Intel CPU, a custom-built AMD Radeon GPU, and stacked second-generation High Bandwidth Memory (HBM2). Connecting the GPU and its memory is Intel’s new “Embedded Multi-Die Interconnect Bridge” (EMIB), a high-speed, short-range interconnect that Intel has designed to join different chips within a single package. Intel says that EMIB enables the creation of faster, thinner packages, enabling the multi-chip module to fit into slimline laptop form factors.
This would rock in a certain set of notebooks I’m very familiar with.